GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made ...

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...

Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, ...

Shares of GlobalFoundries Inc. (GFS) gained more than 1% in pre-market trade on Friday as the company announced an expansion ...

Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Analyst Charles Shi reiterates a Buy rating for Taiwan Semiconductor with $225 price target. Company expects AI revenue to double in 2025.

The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...

The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...

TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...