Summer road trips are among my favorite memories, but they also come with their own challenges. Keeping things organized, ...

Multi-dies stack 3D-ICs are an extension of traditional 2-dies 3D-ICs to address the memory wall and footprint problems. This paper presents a complete Place-and-Route (PnR) flow to enable 3-dies ...

3D RRAM arrays are studied at the device- and architecture-levels. The memory cell performance for a horizontal cross-point is shown experimentally to be essentially comparable to vertical ...