SerDes is all about pushing data through the smallest number of physical channels. But when it comes to AI, more data needs to be moved, and it has to be moved more quickly. Todd Bermensolo, product ...

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization ...

A new technical paper titled “An Energy Efficient Memory Cell for Quantum and Neuromorphic Computing at Low Temperatures” was ...

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will ...

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact circle on the SEM image on the right, you can see that PLDC created a ...

Carefully managing the operating conditions of logic cells and embedded memories directly impacts power consumption.

OLEDs: Shape-morphing panel with built-in speaker; bright stacked microdisplays; graphene-enabled laser lift-off.

A new technical paper titled “Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling” was published by researchers at University of Illinois, Urbana, University ...

Memory Stochastic Computing using ReRAM” was published by researchers at TU Dresden, Center for Scalable Data Analytics and ...

Semiconductor Engineering has compiled a comprehensive list of the types of packages, what’s included in them, and various processes used for assembling them. Included in this report are discussions ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights’ teardown of a Huawei AI ...